Case Size:
44 LB - Pack 
 
TEC Bond 5931F is a freezer grade packaging hot melt offering excellent adhesion to a wide range of materials meant to be in deep freezer environments like boards and papers. The 5931F remains flexible all the way down to -40 Degrees F. The 5931F is a high performance hot melt giving good, clean machining with low char and clogging. It can also be used where a fast melt down tank is required.
 
By Application: 
Product Assembly
 
Bonds To:
Cardboard / Foam
 
Properties:
Temperature - High
Set Time - Medium
Heat Resistant
 
Specifications:
Color: Pale White
Suggested Application Temp: 320F
Brookfield Viscosity: 1,100 cps
Softening Point: 190F
Form: Prills