Case Size:
33 LB - Pack 
 
TEC Bond 2131F was developed for the bookbinding industry, specifically for side gluing. The 2131F is a semi-pressure sensitive hot melt giving a very long open time and good adhesion to many surfaces including coated and glossy stock
 
By Application: 
Bookbinding 
 
Bonds To:
Cardboard / Wood /Plastic
 
Specifications:
Color: Pale Amber
Suggested Application Temp: 320F
Brookfield Viscosity: 4,000 cps
Softening Point: 190F
Form: Pastilles