Case Size:
44 LB - Pack 
 
TEC Bond 4602F is an extremely high performance, heat stable (in both high and low temperatures) bulk hot melt for the packaging industry. The 4602F offers very low odor and clean machining with low char and fewer filter and nozzle blockages. The 4602F is also FDA approved for food and microwave packaging. 
 
By Application: 
Packaging
 
Bonds To:
Cardboard / Foam
 
Properties:
Temperature - High
Set Time - Medium
Heat Resistant
 
Specifications:
Color: White
Suggested Application Temp: 320F
Brookfield Viscosity: 1,700 cps
Softening Point: 225F
Form: Pastilles