Case Size:
26 LB - Pack 
 
TEC Bond 2378 is a high performance bulk hot melt mainly used for product assembly because of its versatility and high bond strength. The 2378 bonds paper, wood, light metals and plastic while offering both high and low temperature resistance. 
Power 2378 has a long open time, allowing fine tuning after the adhesive has been applied. 
 
By Application: 
Product Assembly
 
Bonds To:
Cardboard / Wood /Plastic / General Purpose
 
Specifications:
Color: Dark Amber
Suggested Application Temp: 356F
Brookfield Viscosity: 3,900 cps
Softening Point: 288F
Form: Slats