Case Size:
40 LB - Pack 
 
Henkel Loctite Technomelt PA 7901 polyamide is low viscosity and used specifically for potting and encapsulating applications. The Technomelt PA 7901 offers good heat and vibration resistance and bonds to a wide range of substrates including plastics and metals. Polyamide hot melt adhesives for potting applications allow for fast cure times and easy dispensing and can be a great alternative to epoxies and urethanes.  *Formally known as Hysol 7901 Bulk Hot Melt Adhesive
 
By Application: 
Hot Melt Printing
 
Bonds To:
Cardboard
 
Bonds To:
Metal / Plastic
 
Properties:
Set Time - Fast
Temperature - High
 
Specifications:
Softening Point, °F, ASTM E 28-67 330
Viscosity @ 400°F, cP, ASTM D 3236 750
Open Time, seconds 35
Heat resistance, °F, ASTM D 4498 300
Specific Gravity @ 77°F ASTM D 792 0.99
Tensile Strength, psi, ASTM D 638 260
Elongation, %, ASTM D 638 80
Tg, °F ASTM E 1640